Quantitative Solderability Measurement of Electronic Components

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Abstract
The subject of the quantitative measurement of solderability of electronic components is introduced. The wetting balance in various configurations and modes of operation is being used as the focal point to establish a quantitative measurement capability for solderability of conventional leaded components, surface mounting components and printed circuit interconnections. The principles of operation of the wetting balance and the factors that influence the measurement are discussed. This paper is the first of a series that will cover the development of traceable reference standards for wetting balance calibration, the influence of instrumental design on the measurement, the standardisation of the measurement procedures, the choice and evaluation of a solderability index for the dynamic measurement, and the traceability of the measurement to international standards.

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