Powder LSI: an ultra small RF identification chip for individual recognition applications

22 December 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

Vol. 1 (01936530) , 398-501
https://doi.org/10.1109/isscc.2003.1234354

Abstract

A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.

Keywords

POWDERS
LARGE SCALE INTEGRATION
RADIO FREQUENCY
RADIOFREQUENCY IDENTIFICATION
CIRCUITS
COSTS
MOS CAPACITORS
CMOS PROCESS
CLOCKS
ELECTRODES

This publication has 2 references indexed in Scilit:

An ultra small individual recognition security chip
IEEE Micro, 2001
Low-cost flip-chip on board
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996