Metallurgical topics in silicon device interconnections: Thin film stresses
- 1 January 1989
- journal article
- Published by SAGE Publications in International Materials Reviews
- Vol. 34 (1) , 53-68
- https://doi.org/10.1179/imr.1989.34.1.53
Abstract
No abstract availableThis publication has 83 references indexed in Scilit:
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