Interactions at interface between Cu99Ti1 thin films and polyimide
- 10 March 1997
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 70 (10) , 1251-1253
- https://doi.org/10.1063/1.118525
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusionJournal of Applied Physics, 1994
- Preparation of low resistivity Cu–1 at. %Cr thin films by magnetron sputteringJournal of Vacuum Science & Technology A, 1992
- Interfacial reactions at copper surfaces coated with polyimide films prepared from poly(amide–acid) precursorsJournal of Vacuum Science & Technology A, 1989
- Electronic structure ofO and CuOPhysical Review B, 1988
- The microstructure of metal–polyimide interfacesJournal of Vacuum Science & Technology A, 1988
- Metal polyimide interface: A titanium reaction mechanismJournal of Vacuum Science & Technology A, 1986
- A semiautomatic algorithm for rutherford backscattering analysisNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1986