Reliability comparison of two metallurgies for ceramic ball grid array
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (1) , 53-57
- https://doi.org/10.1109/96.365483
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologiesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969