Effect of Crystal Plane on the Mechanism and the Kinetics of Copper Electrocrystallization
- 1 January 1966
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 113 (5) , 429-440
- https://doi.org/10.1149/1.2423989
Abstract
To study the mechanism and the kinetics of electrocrystallization, electrochemical measurements were supplemented with in situ microscopic observations of growing copper electrodeposits. The growth was followed on main crystal planes of copper single crystals up to an average thickness of the deposit corresponding to 10 coulomb/cm2. Highly purified solutions of in were used.Keywords
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