SUBSURFACE DAMAGE IN GRINDING TITANIUM ALUMINIDE

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Abstract
This paper reports on an experimental investigation of grinding-induced subsurface damage in gamma titanium aluminide (γ-TiAl). Grinding was carried out with resin-bond diamond wheels having the same concentration but different grit sizes, and with a vitreous-bond silicon carbide wheel using various depths of cut. The extent of the subsurface damage was determined by a bonded interface technique and optical microscopy. The grinding-induced damage beneath the ground surfaces was found to consist of plastic deformation and microcracks. The severity and depth of the subsurface damage zone increased with an increase in the abrasive grit size and the depth of cut. Microcracks were observed when grinding was performed with the silicon carbide wheel at a depth of cut of 100 and 125 μm.