Morphology and crystal orientation of chromium thin films deposited by ion plating

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Abstract
Chromium thin films were deposited by ion plating. The influence of argon gas pressure and substrate bias voltage on the morphology and crystal orientation of the films was investigated by using scanning electron micrography (SEM) and x-ray diffraction. The preferred orientation of the films changed from (110) to (200) with the increase of argon gas pressure. Most of chromium films exhibited columnar structure and the width of the column became smaller at higher argon gas pressure. The chromium film which was deposited at higher argon pressure exhibited a finer granular structure. The microhardness of the films increased with the increase of bias voltage and argon gas pressure.

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