The thermal fatigue behavior of hot pressed silicon nitride
- 1 January 1976
- journal article
- Published by Elsevier in Materials Science and Engineering
- Vol. 22, 15-22
- https://doi.org/10.1016/0025-5416(76)90131-2
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Crack propagation and failure prediction in silicon nitride at elevated temperaturesJournal of Materials Science, 1974
- High‐Temperature Strength Behavior of Hot‐Pressed Si3N4: Evidence for Subcritical Crack GrowthJournal of the American Ceramic Society, 1974