Development of a Fine Pitch Bumping Process
- 1 January 1990
- book chapter
- Published by Springer Nature
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Thermal annealing study of Au/TiW metallization on siliconThin Solid Films, 1980
- Studies of the Ti-W/Au metallization on aluminumThin Solid Films, 1978