Module/packaging technologies for optical components: current and future trends
- 30 July 2001
- proceedings article
- Published by SPIE-Intl Soc Optical Eng
- Vol. 4532, 270-280
- https://doi.org/10.1117/12.436020
Abstract
The basic design methodology and criteria required for packaging of optical components are reviewed, and the state-of-art of different types of the packaging technologies of laser modules and receiver modules are addressed. They are Mini-DIL DFB-LD module, wavelength-locker integrated laser module, 10 Gbps receiver module with integrated APD and preamplifier IC, and non-hermetic SMT module. Considerations on future packaging technologies and integrated optical components are also discussed.Keywords
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