Effects of strain rate and temperature on the stress–strain response of solder alloys

• 1 January 1999
• journal article
• Published by Springer Nature in Journal of Materials Science: Materials in Electronics
• Vol. 10  (5/6) , 461-468
• https://doi.org/10.1023/a:1008930430875

Abstract

Keywords

• TEMPERATURE
• DUCTILITY
• STRAIN RATE
• BEHAVIOR
• STRESS
• MODELING
• SOLDER