Hermeticity Testing Of Glass-silicon Packages With On Chip Feed Throughs
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 244-247
- https://doi.org/10.1109/sensor.1995.717156
Abstract
This paper reports on hermeticity test results performed on a silicon-glass hermetic package in aqueous environments. The package utilizes anodic bonding of glass to silicon at temperatures below 320/spl deg/C to form a hermetically sealed cavity large enough to contain hybrid components. Up to 200 sealed polysilicon feedthrough lines can be obtained per mm at the edge of the package. Hermeticity is maintained by planarizing these feedthrough lines, and then depositing a smooth top poly silicon surface for anodic bonding of the glass capsule. Accelerated long term tests indicate a lifetime of at least many years. In-vivo tests in guinea pigs for two months have shown the package to be biocompatible and rugged.Keywords
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