Effect of thermal ageing on (Sn-Ag, Sn-Ag- Zn)/PtAg, Cu/Al2O3 solder joints

• 1 January 1998
• journal article
• Published by Springer Nature in Journal of Materials Science: Materials in Electronics
• Vol. 9  (5) , 373-381
• https://doi.org/10.1023/a:1008940311075

Abstract

Keywords

• SOLDER JOINT
• THERMAL AGEING
• FRACTURE LOAD
• CERAMIC SUBSTRATE
• INTERFACIAL MORPHOLOGY