Quantification of thermal contact conductance in electronic packages
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 717-723
- https://doi.org/10.1109/33.49038
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader MaterialsJournal of Heat Transfer, 1988
- Relative contact pressure - Dependence on surface roughness and Vickers microhardnessJournal of Thermophysics and Heat Transfer, 1988
- Experimental verification of contact conductance models based upon distributed surface micro-hardnessPublished by American Institute of Aeronautics and Astronautics (AIAA) ,1983
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Residual Thermal Stresses Due to Cool-Down of Epoxy-Resin CompositesJournal of Applied Mechanics, 1979