Thermal Fatigue Reliability of SMT Packages and Interconnections
- 1 April 1987
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
- No. 07350791,p. 250-259
- https://doi.org/10.1109/irps.1987.362186
Abstract
The analytic description of thermal stresses and strains in surface mount chip carrier assemblies have been studied by a nonlinear finite element method. Emphasis is placed on the effects of packaging material and package size on interconnection and package reliability. In parallel, test boards with 68-Pin plastic leaded chip carriers (PLCC) have also been made and subjected to temperature cycling. The observed failure mechanism of the solder joints agreed with the finite element results.Keywords
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