Wafer Bonding and Layer Splitting for Microsystems

• 1 December 1999
• journal article
• research article
• Published by Wiley in Advanced Materials
• Vol. 11  (17) , 1409-1425
• https://doi.org/10.1002/(sici)1521-4095(199912)11:17<1409::aid-adma1409>3.0.co;2-w

Abstract