Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization
- 1 May 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 320 (1) , 73-76
- https://doi.org/10.1016/s0040-6090(97)01068-7
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Ion metal plasma (IMP) deposited titanium liners for 0.25/0.18 μm multilevel interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002