An overview of CMOS VLSI failure analysis and the importance of test and diagnostics

24 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 930
https://doi.org/10.1109/test.1996.557160

Abstract

This paper reviews the logic failure analysis process and the critical need for design-for-diagnostics. The use of flip-chip packaging will render hardware-based diagnostic techniques from the front side of the die obsolete, e.g., liquid crystal, electron beam testing, and photon emission microscopy. Two primary solutions are discussed: software-based diagnostic methods, e.g., scan, and the adaptation of hardware techniques to the backside of the die.

Keywords

VERY LARGE SCALE INTEGRATION
FAILURE ANALYSIS
PHOTONIC CRYSTALS
CMOS LOGIC CIRCUITS
LOGIC DESIGN
PACKAGING
LIQUID CRYSTALS
ELECTRON BEAMS
TESTING
ELECTRON MICROSCOPY

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