Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
- 1 March 2000
- journal article
- research article
- Published by Springer Nature in Metallurgical and Materials Transactions A
- Vol. 31 (3) , 798-800
- https://doi.org/10.1007/s11661-000-0022-5
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Ternary System Au–Ni–SnJournal of Solid State Chemistry, 1996
- The Au-Pb-Sn ternary systemJournal of the Less Common Metals, 1967