Thermal analysis of a multi-chip package design
- 1 March 1989
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 18 (2) , 267-274
- https://doi.org/10.1007/bf02657418
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- A high-performance thermal module for computer packagingJournal of Electronic Materials, 1987
- A thermal module design for advanced packagingJournal of Electronic Materials, 1987
- Thermal Management of Air- and Liquid-Cooled Multichip ModulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Improved Electrical Performance Required for Future MOS PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- A Conduction-Cooled Module for High-Performance LSI DevicesIBM Journal of Research and Development, 1982
- LINPACK Users' GuidePublished by Society for Industrial & Applied Mathematics (SIAM) ,1979
- Thermal conductance of indium solder joints at low temperaturesReview of Scientific Instruments, 1977
- Thermal properties of very fast transistorsIEEE Transactions on Electron Devices, 1970
- Experimental Evidence of Thermal Resistance at Soldered JointsJournal of Spacecraft and Rockets, 1969
- Parametric Study of Temperature Profiles in Chips Joined by Controlled Collapse TechniquesIBM Journal of Research and Development, 1969