Directly Bonded Copper Metallization of AℓN Substrates for Power Hybrids
- 1 January 1984
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic MethodJournal of the Electrochemical Society, 1975
- Some Properties of Aluminum NitrideJournal of the Electrochemical Society, 1960