Three-dimensional interconnect analysis using partial element equivalent circuits
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems I: Regular Papers
- Vol. 39 (11) , 974-982
- https://doi.org/10.1109/81.199878
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
- C3DSTAR: a 3D wiring capacitance calculatorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Circuit models for three-dimensional geometries including dielectricsIEEE Transactions on Microwave Theory and Techniques, 1992
- Simulating EM fieldsIEEE Spectrum, 1991
- Transient scattering by conducting surfaces of arbitrary shapeIEEE Transactions on Antennas and Propagation, 1991
- An Iterative Technique Based on the Method of Least Squares Applied to Scattering Problems Using the k-Space ApproachJournal of Electromagnetic Waves and Applications, 1991
- FastCap: a multipole accelerated 3-D capacitance extraction programIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1991
- Approximate time-domain models of three-dimensional interconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990
- Numerical Solution of Steady-State Electromagnetic Scattering Problems Using the Time-Dependent Maxwell's EquationsIEEE Transactions on Microwave Theory and Techniques, 1975
- Equivalent Circuit Models for Three-Dimensional Multiconductor SystemsIEEE Transactions on Microwave Theory and Techniques, 1974
- Algorithms for ASTAP--A network-analysis programIEEE Transactions on Circuit Theory, 1973