Via hole, bond wire and shorting pin modeling for multi-layered circuits

This publication has 10 references indexed in Scilit:

• Analysis of a microstrip line terminated with a shorting pin
  IEEE Transactions on Microwave Theory and Techniques, 1992
• Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique
  IEEE Transactions on Microwave Theory and Techniques, 1992
• Analysis of 3-D metallization structures by a full-wave spectral-domain technique
  IEEE Transactions on Microwave Theory and Techniques, 1992
• Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method
  IEEE Transactions on Microwave Theory and Techniques, 1991
• A generalized method for distinguishing between radiation and surface-wave losses in microstrip discontinuities
  IEEE Transactions on Microwave Theory and Techniques, 1990
• Basic blocks for high-frequency interconnects: theory and experiment
  IEEE Transactions on Microwave Theory and Techniques, 1988
• Three-Dimensional Finite-Difference Method for the Analysis of Microwave-Device Embedding
  IEEE Transactions on Microwave Theory and Techniques, 1987
• The Transmission-Line Matrix Method--Theory and Applications
  IEEE Transactions on Microwave Theory and Techniques, 1985
• Spectral Domain Immitance Approach for Dispersion Characteristics of Generalized Printed Transmission Lines
  IEEE Transactions on Microwave Theory and Techniques, 1980
• Spectral-Domain Approach for Calculating the Dispersion Characteristics of Microstrip Lines (Short Papers)
  IEEE Transactions on Microwave Theory and Techniques, 1973