Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
Top Cited Papers
- 11 December 2012
- journal article
- research article
- Published by Optica Publishing Group in Optical Materials Express
- Vol. 3 (1) , 35-46
- https://doi.org/10.1364/ome.3.000035
Abstract
Optics InfoBase is the Optical Society's online library for flagship journals, partnered and copublished journals, and recent proceedings from OSA conferences.Keywords
This publication has 16 references indexed in Scilit:
- Integration of Edge-Emitting Laser Diodes With Dielectric Waveguides on SiliconIEEE Photonics Technology Letters, 2012
- Low-Threshold Heterogeneously Integrated InP/SOI Lasers With a Double Adiabatic Taper CouplerIEEE Photonics Technology Letters, 2011
- Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic DevicesElectrochemical and Solid-State Letters, 2011
- Recent progress in lasers on siliconNature Photonics, 2010
- III‐V/silicon photonics for on‐chip and intra‐chip optical interconnectsLaser & Photonics Reviews, 2010
- Low-threshold thin-film III-V lasers bonded to silicon with front and back side defined featuresOptics Letters, 2009
- Nanophotonic waveguides in silicon-on-insulator fabricated with CMOS technologyJournal of Lightwave Technology, 2005
- Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bondingJournal of Micromechanics and Microengineering, 2004
- Demonstration of a silicon Raman laserOptics Express, 2004
- Monolithic InGaAsP optoelectronic devices with silicon electronicsIEEE Journal of Quantum Electronics, 2001