IC Process Compatible Preparation of Silicon Interfaces Using the Silicon-to-Silicon Direct Bonding Method
- 1 January 1989
- book chapter
- Published by Springer Nature
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- Silicon-to-silicon direct bonding methodJournal of Applied Physics, 1986
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986