Wire Bond Integrity Test Chip

• 1 April 1983
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• https://doi.org/10.1109/irps.1983.361975

Abstract

Keywords

• NONDESTRUCTIVE EVALUATION
• NONDESTRUCTIVE TESTING
• TIME MEASUREMENT
• KELVIN
• CHIP
• ALUMINUM
• INTEGRATION TESTING