Accelerated vibration fatigue life testing of leads and soldered joints

• 27 January 1976
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 15  (3) , 213-219
• https://doi.org/10.1016/0026-2714(76)90754-x

Abstract

Keywords

• EXCITATION
• SOLDER JOINTS
• FATIGUE
• SWEPT
• BOARD
• VIBRATION
• EXPONENT