Assembly and reliability of thermally enhanced high I/O BGA packages

Publisher Website

23 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/iemt.1997.626868

Abstract

No abstract available

Keywords

This publication has 1 reference indexed in Scilit:

High Sensitivity Moiré
Published by Springer Nature ,1994