High-density memory packaging technology high-speed imaging applications
- 1 January 1991
- proceedings article
- Published by SPIE-Intl Soc Optical Eng
- Vol. 1346, 200-210
- https://doi.org/10.1117/12.23349
Abstract
Advancements in image acquisition and processing technology are exceeding the capability of traditional magnetic tape recording. For scientific industrial and military applications a solid state high-density recording medium is required to store data generated at a rate of tens of Gigabits per second from moderate resolution high frame rate imagers. This paper discusses a three-dimensional (3-D) approach to memory packaging developed jointly by DARPA and Texas Instruments (TI). This packaging approach makes it feasible to economically produce a small rugged recorder for high speed solid state imaging applications. 1.Keywords
This publication has 0 references indexed in Scilit: