Abstract
Advancements in image acquisition and processing technology are exceeding the capability of traditional magnetic tape recording. For scientific industrial and military applications a solid state high-density recording medium is required to store data generated at a rate of tens of Gigabits per second from moderate resolution high frame rate imagers. This paper discusses a three-dimensional (3-D) approach to memory packaging developed jointly by DARPA and Texas Instruments (TI). This packaging approach makes it feasible to economically produce a small rugged recorder for high speed solid state imaging applications. 1.

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