Semiconductor sheets for the manufacture of semiconductor devices
- 1 March 1963
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Communication and Electronics
- Vol. 82 (1) , 94-98
- https://doi.org/10.1109/tce.1963.6373306
Abstract
The temperature distribution in a supercooled melt is qualitatively described. Properly shaped heat shields are shown to overcome parasitic wall growth and thermal shock, besides being an additional means of controlling thermal conditions. Using such a setup, it is possible to grow material in continuous sheets with a wide range of physical dimensions. The sheets are single crystals, dislocation-free, and have excellent surfaces.Keywords
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