Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIs

Publisher Website

1 January 1993

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 121-122
https://doi.org/10.1109/vlsit.1993.760278

Abstract

No abstract available

This publication has 0 references indexed in Scilit: