New challenges in solder-paste printing

• 1 September 1991
• journal article
• Published by World Scientific Pub Co Pte Ltd in Journal of Electronics Manufacturing
• Vol. 1  (1) , 29-40
• https://doi.org/10.1142/s0960313191000059

Abstract

Keywords

• MODELS
• EQUIPMENT
• STENCIL
• EMPIRICAL DATA
• SOLDER PASTE PRINTING
• CHALLENGES IN SOLDER