A Study on the Method of Elastic-Plastic-Creep Finite Element Analysis for a Solder Joint in a Surface Mounted Component.
- 1 January 1996
- journal article
- Published by Japan Society of Mechanical Engineers in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
- Vol. 62 (594) , 527-532
- https://doi.org/10.1299/kikaia.62.527
Abstract
A model of a surface-mounted gull-wing-leaded device was proposed for elastic-plastic-creep finite element analysis. Stresses and strains of a solder joint und ercyclic thermal loads were analyzed. Plastic strain and creep strain were calculated, even for the temperature-change domain. The results of cyclic hysteresis behaviors were compared with those analyzed based upon the conventional model in which both the dependence of temperature on the yield stress of the solder and creep behavior in loading and unloading temperature cycling were ignored. It has been found that it is essential to consider these factors. The effects of the parameters such as temperature increments, strain rate and dwell time on the analytical results of stress were also studied.Keywords
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