Non-contact monitoring of electrical characteristics of silicon surface and near-surface region

Abstract
The SPV-based method of Surface Charge Profiling (SCP) is discussed, and its applications in silicon surface monitoring in IC manufacturing are reviewed. The SCP method shows high sensitivity to changes in the condition of the Si surface (e.g. surface cleaning operations) and a very thin near-surface region (e.g. variations of active dopant concentration near the surface).

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