16×16 VCSEL Array Flip-chip bonded to CMOS VLSI Circuit
- 1 January 1999
- proceedings article
- Published by Optica Publishing Group
Abstract
We have flip-chip bonded a 16x16 array of970nm VCSELs to a Silicon CMOS circuit. The device yield after bonding and packaging of the Optoelectronic-VLSI chip is approximately 96%. Individual VCSELs are capable of being modulated by the circuit at IGbit/s. Parallel testing of up to 80VCSELs at IGbit/s per VCSEL is presented.Keywords
This publication has 1 reference indexed in Scilit:
- Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuitsIEEE Photonics Technology Letters, 1999