High-Frequency Performance of TAB
- 1 June 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (2) , 199-203
- https://doi.org/10.1109/tchmt.1987.1134739
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- TAB Versus Wire Bond-Relative Thermal PerformanceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Computing Inductive Noise of Chip PackagesAT&T Bell Laboratories Technical Journal, 1984
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- High - Density High - Impedance Hybrid Circuit Technology for Gigahertz LogicIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979