Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift

This publication has 3 references indexed in Scilit:

• The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998
• DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment
  Published by Springer Nature ,1995
• Thermal characterization of electronic devices with boundary condition independent compact models
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995