Positron annihilation at the Si/SiO2 interface

Abstract
Variable‐energy positron annihilation depth‐profiling has been applied to the study of the Si/SiO2 interface in Al‐gate metal‐oxide‐semiconductor (MOS) structures. For both n‐ and p‐type silicon under conditions of negative gate bias, the positron annihilation S‐factor characteristic of the interface (Sint) is substantially modified. Temperature and annealing behavior, combined with known MOS physics, suggest strongly that Sint depends directly on holes at interface states or traps at the Si/SiO2 interface.

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