Reliability of Flip Chip Solder Bump Joints

• 1 March 1982
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• https://doi.org/10.1109/irps.1982.363016

Abstract

Keywords

• ASSEMBLY
• PLASTICS
• PACKAGING
• FLIP CHIP
• MICROSTRUCTURES
• FAILURE RATE
• CAPACITIVE SENSORS
• FAILURE ANALYSIS
• CHIP
• CROSS SECTION
• TEMPERATURE
• THERMAL EXPANSION