Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins
Top Cited Papers
- 6 July 2000
- Vol. 41 (22) , 7941-7949
- https://doi.org/10.1016/s0032-3861(00)00164-6
Abstract
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This publication has 12 references indexed in Scilit:
- Very high thermal conductivity obtained by boron nitride-filled polybenzoxazineThermochimica Acta, 1998
- The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrateIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998
- Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic ApplicationsPolymers for Advanced Technologies, 1997
- Influence of Void Shape, Void Volume and Matrix Anisotropy on Effective Thermal Conductivity of a Three-Phase CompositeJournal of Composite Materials, 1996
- Catalyzing the curing reaction of a new benzoxazine‐based phenolic resinJournal of Applied Polymer Science, 1995
- Curing kinetics of a new benzoxazine-based phenolic resin by differential scanning calorimetryPolymer, 1995
- Phenolic materials via ring‐opening polymerization: Synthesis and characterization of bisphenol‐A based benzoxazines and their polymersJournal of Polymer Science Part A: Polymer Chemistry, 1994
- Phenolic materials via ring‐opening polymerization of benzoxazines: Effect of molecular structure on mechanical and dynamic mechanical propertiesJournal of Polymer Science Part B: Polymer Physics, 1994
- The importance of material selection for flip chip on board assembliesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Cure behavior of an epoxy–novolac molding compoundJournal of Applied Polymer Science, 1992