Relationship between Phenolic Adhesive Chemistry, Cure and Joint Performance. Part I. Effects of Base Resin Constitution and Hardener on Fracture Energy and Thermal Effects During Cure

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Abstract
In this study the relationships between the composition of phenol resorcinol-formaldehyde resins and paraformaldehyde concentration in the adhesive were explored, using DSC, IR, GPC, and solubility measurements. Differences of chemical composition between base resins and adhesives were compared to the fracture toughness of adhesive bonds. The cure temperature and cure time effects upon fracture toughness were also investigated. Fracture toughness tests were performed with bonded hard maple tapered double-cantilever beam cleavage specimens.