A novel technology that makes it possible to transfer thin film devices from an original substrate to the other one by using laser ablation/annealing has been developed. This technology is named SUFTLA which stands for surface free technology by laser ablation/annealing. In the process of this technology, polycrystalline-silicon thin film transistors and TAFT circuits, which are firstly fabricated by the low-temperature process below 425 degrees C on quartz or glass substrates, are transferred onto plastic substrates. Any degradation during the transfer process are not observed. By using this technology, CMOS ring oscillators and a TAFT array with integrated drivers for LCD have been developed on plastic substrates and their compete operations were confirmed. This technology is not only applied for displays such as LCD and OELD, but also to any kinds of TAFT circuits including memories and logics on plastics. It also enable us to fabricate a 3D ICs with a very simple manner.