Relay Contact Behavior Under Non-Eroding Circuit Conditions
- 1 May 1958
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Bell System Technical Journal
- Vol. 37 (3) , 777-814
- https://doi.org/10.1002/j.1538-7305.1958.tb03886.x
Abstract
When palladium or platinum-family metal contacts are operated in an environment which includes organic vapors, the performance of the contacts may be seriously degraded. If the contacts open and close currents, the contact erosion may be increased en...Keywords
This publication has 1 reference indexed in Scilit:
- The influence of dust particles on the contact of solidsProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1956