Therhionic Integrated Circuits: Electronics for Hostile Environments

1 January 1985

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Nuclear Science

Vol. 32 (6) , 3996-4000
https://doi.org/10.1109/TNS.1985.4334057

Abstract

Thermionic integrated circuits (TICs) combine thermionic emission of vacuum tube technology with the thin-film deposition and photolithographic delineation techniques of conventional silicon integrated circuits to form microminiature-integrated vacuum triode circuits. The resulting integrated circuits are extremely tolerant to both high-radiation and high-temperature environments.

Keywords

CATHODES
SUBSTRATES
ANODES
BONDING
CIRCUIT TESTING
ELECTRON EMISSION
TITANIUM
ELECTRODES
VOLTAGE
THERMIONIC EMISSION

This publication has 2 references indexed in Scilit:

Radiation-induced conductivity of ${Al}_{2}$ $O_{3}$ : Experiment and theory
Physical Review B, 1980
Mechanism of electron emission into a vacuum from formed MDM systems
Russian Physics Journal, 1979