Selectively grown vertical Si- p MOS transistorwith short channel lengths

Abstract
Vertical p-MOS transistors with channel lengths of ~130 nm have been fabricated using selective LPCVD epitaxy for the definition of the channel region, instead of fine line lithography. Owing to self-aligned facet growth the channel region and the volume diode which limited the parasitic bipolar transistor can be designed more independently. Thus a short-channel p-MOS transistor with a high breakthrough voltage, an ideal subthreshold behaviour and a high transconductance was fabricated.

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