Plasma chemical vapor deposition of thin platinum films

Abstract
The metal organic plasma-enhanced chemical vapor deposition of platinum films using cyclopentadienyl-trimethyl-platinum as starting material is reported. Three different reactors are compared and the influence of power, substrate temperature, and temperature of the reservoir with the organometallic has been studied. Films with ≊100% Pt and a resistivity of 46 μΩ cm have been deposited.

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