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Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates
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Publications
Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates
Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates
JB
J.N. Burghartz
J.N. Burghartz
DE
D.C. Edelstein
D.C. Edelstein
KJ
K.A. Jenkins
K.A. Jenkins
CJ
C. Jahnes
C. Jahnes
CU
C. Uzoh
C. Uzoh
EO
E.J. O'Sullivan
E.J. O'Sullivan
KC
K.K. Chan
K.K. Chan
MS
M. Soyuer
M. Soyuer
PR
P. Roper
P. Roper
SC
S. Cordes
S. Cordes
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23 December 2002
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/iedm.1996.553131
Abstract
No abstract available
Keywords
Q FACTOR
SILICON
VLSI
QUALITY FACTOR
SI
INDUCTORS
COPPER
MMIC
Cited
Cited by 44 articles
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