Abstract
Packaging‐related PV module failure is distinguished from cell failure, and those failures specific to thin‐film modules are reviewed. These are categorized according to the type of stress that produced them, e.g., temperature, voltage, moisture, current, and thermal cycling. An example is given that shows how to relate time under accelerated stress to time in use. Diagnostic tools for locating the affected area within a large‐area module are pointed out along with the importance of interpretation of the visual appearance of the different damage mechanisms. Copyright © 2004 John Wiley & Sons, Ltd.