16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit
- 1 August 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 12 (8) , 1073-1075
- https://doi.org/10.1109/68.868012
Abstract
We report the flip-chip bonding of a 16/spl times/16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VCSELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1/spl deg/C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated.Keywords
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